AI method radically speeds predictions of materials’ thermal properties
The approach could help engineers design more efficient energy-conversion systems and faster microelectronic devices, reducing waste heat.
The approach could help engineers design more efficient energy-conversion systems and faster microelectronic devices, reducing waste heat.
The technique characterizes a material’s electronic properties 85 times faster than conventional methods.
Ashutosh Kumar, a materials science and engineering PhD student and MathWorks Fellow, applies his eclectic skills to studying the relationship between bacteria and cancer.
Innovative AI system from MIT CSAIL melds simulations and physical testing to forge materials with newfound durability and flexibility for diverse engineering uses.
Using machine learning, the computational method can provide details of how materials work as catalysts, semiconductors, or battery components.
Computer vision enables contact-free 3D printing, letting engineers print with high-performance materials they couldn’t use before.
This AI system only needs a small amount of data to predict molecular properties, which could speed up drug discovery and material development.
A new method could provide detailed information about internal structures, voids, and cracks, based solely on data about exterior conditions.
These tunable proteins could be used to create new materials with specific mechanical properties, like toughness or flexibility.