Electrical engineering and computer science (EECS)
Electrical engineering and computer science (EECS)

With AI, researchers predict the location of virtually any protein within a human cell

Trained with a joint understanding of protein and cell behavior, the model could help with diagnosing disease and developing new drugs.

Study shows vision-language models can’t handle queries with negation words

Words like “no” and “not” can cause this popular class of AI models to fail unexpectedly in high-stakes settings, such as medical diagnosis.

Hybrid AI model crafts smooth, high-quality videos in seconds

The CausVid generative AI tool uses a diffusion model to teach an autoregressive (frame-by-frame) system to rapidly produce stable, high-resolution videos.

Novel AI model inspired by neural dynamics from the brain

New type of “state-space model” leverages principles of harmonic oscillators.

Making AI models more trustworthy for high-stakes settings

A new method helps convey uncertainty more precisely, which could give researchers and medical clinicians better information to make decisions.

The MIT-Portugal Program enters Phase 4

New phase will support continued exploration of ideas and solutions in fields ranging from AI to nanotech to climate — with emphasis on educational exchanges and entrepreneurship.

Merging design and computer science in creative ways

MAD Fellow Alexander Htet Kyaw connects humans, machines, and the physical world using AI and augmented reality.

Novel method detects microbial contamination in cell cultures

Ultraviolet light “fingerprints” on cell cultures and machine learning can provide a definitive yes/no contamination assessment within 30 minutes.

“Periodic table of machine learning” could fuel AI discovery

Researchers have created a unifying framework that can help scientists combine existing ideas to improve AI models or create new ones.

3D modeling you can feel

TactStyle, a system developed by CSAIL researchers, uses image prompts to replicate both the visual appearance and tactile properties of 3D models.