New materials could boost the energy efficiency of microelectronics
By stacking multiple active components based on new materials on the back end of a computer chip, this new approach reduces the amount of energy wasted during computation.
By stacking multiple active components based on new materials on the back end of a computer chip, this new approach reduces the amount of energy wasted during computation.
Agreement between MIT Microsystems Technology Laboratories and GlobalFoundries aims to deliver power efficiencies for data centers and ultra-low power consumption for intelligent devices at the edge.
An electronic stacking technique could exponentially increase the number of transistors on chips, enabling more efficient AI hardware.
This new device uses light to perform the key operations of a deep neural network on a chip, opening the door to high-speed processors that can learn in real-time.
MIT engineers developed a tag that can reveal with near-perfect accuracy whether an item is real or fake. The key is in the glue on the back of the tag.
The SecureLoop search tool efficiently identifies secure designs for hardware that can boost the performance of complex AI tasks, while requiring less energy.